

Exactly this! As someone who owns a Sony Xperia 1 VI, it’s worth pointing out too that Sony managed to achieve this level of waterproof with a tool-less SIM/SD card tray too, which you can simply pull out the card tray with your finger, without having to use a pin. Sony likely chose this design because they wanted to market the Xperia phones to photography enthusiasts (as can be seen in their marketing), so they wanted make it quick and simple to swap the SD card between the phone and a PC for transferring photos, like when you’re using a proper DLSR camera. And they’ve been using this tool-less tray design since the 2nd gen model that came out 6 years ago, it’s a proven reliable design.
So yeah waterproofing a phone really wasn’t as hard as some of those manufecturers tried to suggest.
There are many other companies who made waterproof phones with replaceable battery too with good IP rating.it was never a technology problem.






It will never lighten the demand because the speed they are building new data centers is always going to be faster than any DRAM manufacturer can ramp up production rate on their existing production line or building new production line. Building data centers is always easier than making DRAM chips in a fab because of the complete different level of technological sophistication.
This can only help reduce the rate which the demand sprints further and further ahead than supply, but ultimately the only thing that can stop the demand from further increasing exponentially so that DRAM supply could catch up and start to lower down the price is for the whole generative AI industry (among other things) to implode so they don’t all race against each other building new data centers anymore.
And we can already see that new consumer DDR5 RAM boards and consumer products using the Chinese CXMT DRAM chips (such as some of the recent Lenovo ThinkPad laptops) are not one cent cheaper than similar spec’ed products using non-Chinese DRAM chips, in fact some are even $100-200 more expensive, probably because the scale of supply chain is still lagging behind for them because the Chinese DRAM chips with modern specs only became available in the market relatively recently.